Romanescu will lead process engineering, qualification, and yield across the SHIP™ platform’s foundry network as production ramps
GRENOBLE, France, Sept. 29, 2026 (GLOBE NEWSWIRE) — Scintil Photonics, the global technology leader in Heterogeneous Integrated Photonics for next-generation DWDM AI infrastructure, today announced that Alexandru Romanescu has joined the company as Vice President of Process Engineering. Romanescu has spent nearly two decades taking semiconductor and photonic processes from development into volume manufacturing. At Scintil, he leads process engineering, qualification, and yield across the foundry network behind SHIP™ (Scintil Heterogeneous Integrated Photonics), the company’s photonic integration platform, as production ramps.
Romanescu’s career has run through every stage of bringing a process to volume. He industrialized a photonic integrated circuit pilot line and drove photonic integration platforms from development to a design- and manufacturing-ready state, setting process control, test, and qualification requirements at each maturity step. He has run operations spanning supply chain, foundry relations, quality systems, and production test. Romanescu developed advanced CMOS logic processes with volume-ramp support across multiple products and customers, and he managed the industrial transfer of RF semiconductor processes into foundry production. He holds a PhD in microelectronics from Université de Grenoble and returns to the city where Scintil is headquartered.
“Our platform is out of the fab and wafers are cycling on a production cadence. That changes what the company has to be,” said Matt Crowley, CEO of Scintil Photonics. “The move from a development rhythm to production discipline needs an owner. Alexandru has done a lot of high-volume work, and he has taken photonic platforms to manufacturing readiness before. He will own that transition for SHIP™.”
“I have spent my career asking the question: is this process ready for volume?” said Romanescu. “Scintil convinced me because the answer is built into the platform. It runs on standard high-volume tools and flows, it can be tested at the wafer level, and quality is designed in rather than inspected in. Photonics is entering its volume manufacturing era, and this is where I want to do that work.”
SHIP™ integrates active lasers with established silicon photonics on a single chip and has been validated on Tower Semiconductor’s production lines. It uses standard foundry flows and wafer-level testing. LEAF Light™, its first commercial product, is a single-chip DWDM laser source available to customers through an early-access evaluation program.
About Scintil Photonics
Scintil Photonics is the global leader in DWDM laser sources for AI. Using its SHIP™ (Scintil Heterogeneous Integrated Photonics) technology, Scintil developed LEAF Light™, the world’s first single-chip DWDM laser source for high-density optical connectivity in scale-up networks. LEAF Light™ enables hyperscalers to meet the power, tail latency, utilization, and bandwidth demands of large-scale GPU clusters, leveraging next-generation co-packaged optics (CPO). Headquartered in Grenoble, France, with operations across North America, Scintil is built to support global needs for advanced AI infrastructure. www.scintil-photonics.com
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Isaac Lopez
OmniScale Media (For Scintil Photonics)
360-576-5475
isaac@omniscalemedia.com
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