Dublin, Jan. 27, 2026 (GLOBE NEWSWIRE) — The “Envelope Tracking Chip Market Report 2026” has been added to ResearchAndMarkets.com’s offering. The report offers comprehensive insights, detailing market size, regional shares, competitors, trends, and opportunities. It provides an extensive analysis of current conditions and forecasts, vital for entities aiming to thrive amid rapid changes on the international stage.
The envelope tracking chip market continues its robust growth, with projections increasing from $2.43 billion in 2025 to $2.65 billion in 2026, registering a CAGR of 8.9%. The surge can be attributed to factors such as the widespread adoption of smartphones, early deployment of 4G LTE technologies, and the ever-increasing demand for battery-efficient mobile devices. Additionally, expansions in wireless communication standards and RF component integration further fuel this growth.
Ahead, the market is expected to reach $3.81 billion in 2030, driven by a 9.6% CAGR, owing to ongoing 5G rollouts, advanced PMIC solutions, and the rise of high-efficiency RF front-end modules. Important trends include the development of cloud-connected envelope tracking architectures, IoT-enabled RF power management, AI-enhanced signal optimization, and automated chip manufacturing technologies. High-efficiency smart amplification systems are also propelling the market forward.
The electronics industry’s growth is a significant driver for the envelope tracking chip market, encompassing diverse categories like consumer electronics and telecommunications equipment. For instance, in May 2023, Japan’s electronic equipment production reached approximately $5.6 billion, with consumer electronics increasing to $233 million, underscoring the upward trajectory that supports envelope tracking chip expansion.
Key players in the market are pioneering inventive solutions such as Qualcomm’s Snapdragon X35 5G Modem-RF System with the QET5100 Envelope Tracking. These technologies improve power amplifier efficiency in mobile devices, exemplified by Qualcomm’s integration of the QET5100 technology in their Snapdragon X35, marking a milestone in power-efficient 5G NR-Light modem-RF systems. Navitas Semiconductor Corporation’s acquisition of Halo Microelectronics for $20 million in February 2023 further bolsters its PMIC portfolio with advanced capabilities for sectors like electric vehicles and data centers.
Major companies operating in the envelope tracking chip market include Analog Devices, Broadcom, Efficient Power Conversion, MediaTek, Qorvo, Qualcomm, R2 Semiconductor, Skyworks Solutions, Texas Instruments, among others. Regions like North America currently lead the market, while Asia-Pacific is poised to be the fastest-growing region.
Report Scope:
- Market Characteristics: Defines and explains market dynamics, major products and services, brand differentiation, and major innovation trends.
- Supply Chain Analysis: Provides insights into the value chain, from raw materials to supplier dynamics and competitor analysis at each chain level.
- Updated Trends and Strategies: Explores emerging tech trends such as digital transformation, automation, and AI innovations, advising how businesses can leverage these for competitive enhancement.
- Regulatory and Investment Landscape: Analyzes regulatory frameworks, investment flows, and policies impacting market dynamics.
- Market Size and Forecast: Detailed analysis of historic market growth and predictions based on current influences, including tech advancements, geopolitical events, and economic policies.
- Market Potential: Explores total addressable market opportunities, comparing current market size with potential growth.
- Market Attractiveness Scoring: Evaluation through a detailed scoring framework that aids decision-makers in understanding strategic implications.
- Segmentations and Regional Analysis: In-depth exploration of market subdivisions, with expanded geographic coverage to reflect shifts in the global value chain.
- Competitive Landscape: Identifies market competition, key players, and significant financial transactions shaping the market.
- Company Scoring Matrix: Ranks industry leaders based on market metrics such as revenue, innovation, and brand recognition.
The report offers extensive coverage of technologies in cellular, wireless, and satellite communications, applications in smart devices, and diverse industries including telecommunications, healthcare, consumer electronics, and more. Highlighted companies include tech giants like Analog Devices Inc., Broadcom Inc., Qualcomm Inc., and more, across several countries and regions. Historical data comparisons, trends, and future forecasts are included for crucial decision-making, with convenient delivery formats enhancing user experience.
Added Benefits: Enjoy bi-annual data updates, customization options, and expert consultant support. Customization is limited to 20% of report content, and consultancy is capped at 8 hours.
Key Attributes
| Report Attribute | Details |
| No. of Pages | 250 |
| Forecast Period | 2026-2030 |
| Estimated Market Value (USD) in 2026 | $2.65 Billion |
| Forecasted Market Value (USD) by 2030 | $3.81 Billion |
| Compound Annual Growth Rate | 9.6% |
| Regions Covered | Global |
The companies featured in this Envelope Tracking Chip market report include:
- Analog Devices Inc.
- Broadcom Inc.
- Efficient Power Conversion Corporation
- MediaTek Inc.
- Qorvo Inc.
- Qualcomm Incorporated
- R2 Semiconductor Inc.
- Skyworks Solutions Inc.
- Texas Instruments Incorporated.
- Maxim Integrated Products Inc.
- Nujira Ltd.
- Samsung Electronics Co. Ltd.
- NXP Semiconductors N.V.
- Infineon Technologies AG
- STMicroelectronics N.V.
- MACOM Technology Solutions Holdings Inc.
- Murata Manufacturing Co. Ltd.
- TDK Corporation
- Taiyo Yuden Co. Ltd.
- Microchip Technology Inc.
- Renesas Electronics Corporation
- Toshiba Corporation
- ROHM Semiconductor
- ON Semiconductor Corporation
For more information about this report visit https://www.researchandmarkets.com/r/5cldz9
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- Envelope Tracking Chip Market
